Discover the power of ultra compact embedded intelligence with our Tiny Titan: Pluto XZU20
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Unleash unmatched flexibility and precision for Next-gen RF applications with its advanced RFSoC technology, delivering ultra-low power while pushing performance to new limits.

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Ultra-small and power-packed in 30 mm: Pluto XZU20 drives advanced sensing, remote ops, and industrial control with AMD MPSoC performance.

Limitless applications. Boundless potential.

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Unleash next-gen Edge AI in robotics, smart vision and autonomous systems with the Lynx SAI50. Powered by SiMa.ai’s Modalix MLSoC, it delivers seamless AI acceleration and advanced vision processing.

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Andromeda XZU90: Unmatched performance and connectivity for high-speed applications.

DDR4 ECC, eMMC, dual Gigabit Ethernet, and USB 3.0 power seamless, reliable performance at the edge.

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Discover how VPX and VNX+ deliver high reliability and performance in harsh environments and protect the modules from shock, vibration, and extreme temperatures.

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Our Innovation Studio—From concept to deployment. We’ve Got You Covered!

Custom consulting, problem-fixing, and hands-on support across all major architectures to keep your innovation ahead and reduce your Time-to-Market.

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Enclustra Design-in Kits help shorten time-to-market for any AMD Zynqâ„¢ UltraScale+â„¢ MPSoC based application. Be it image processing, machine vision, test & measurement, communication or medical: With an Enclustra System-on-Module, the development time can be halved.

To shorten time-to-market as much as possible, Enclustra offers broad design-in support for their products and a comprehensive ecosystem, offering all required hardware, software and support materials. Detailed documentation and reference designs make it easy to get started. A user manual, user schematics, a 3D model, PCB footprints, differential I/O length tables and the Linux-based Board Support Package (BSP) are all provided. In combination with ready-made base boards and heatsinks, developing an FPGA project has never been easier.

AI/Machine Learning Examples Included

The design-in kits include 2 example applications, to get you started: AI face detection and image classification. They are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.

Enclustra Design-in Kits help shorten time-to-market for any AMD Zynqâ„¢ UltraScale+â„¢ MPSoC based application. Be it image processing, machine vision, test & measurement, communication or medical: With an Enclustra System-on-Module, the development time can be halved.

To shorten time-to-market as much as possible, Enclustra offers broad design-in support for their products and a comprehensive ecosystem, offering all required hardware, software and support materials. Detailed documentation and reference designs make it easy to get started. A user manual, user schematics, a 3D model, PCB footprints, differential I/O length tables and the Linux-based Board Support Package (BSP) are all provided. In combination with ready-made base boards and heatsinks, developing an FPGA project has never been easier.

AI/Machine Learning Examples Included

The design-in kits include 2 example applications, to get you started: AI face detection and image classification. They are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.

The Enclustra Lynx SAI50 SoM, powered by the SiMa.ai Modalix MLSoC, delivers high-efficiency Edge AI performance in a compact form. With a top-tier ML accelerator, ARM cores, vision processors, and video codecs, it supports demanding AI and computer vision tasks. Extensive connectivity, large on-chip memory, and support for LPDDR5, eMMC, QSPI, HDMI, and USB ensure seamless integration. Ideal for smart cities, robotics, healthcare, drones, and autonomous driving.

The Mars AX3 FPGA module is equipped with a powerful, low-cost AMD Artix-7â„¢ 28nm FPGA, Gigabit Ethernet, and fast DDR3 SDRAM, making it perfectly suited for high-speed communication and DSP applications.

The SO-DIMM form factor allows space-saving hardware designs, and speedy, simple integration of the FPGA board into the target application.

FPGA Device: XC7A35T, XC7A50T, XC7A100T

The Mercury+ SA2 system-on-chip (SoC) module combines Intel’s Cyclone V ARM Processor-based SoC FPGA with fast DDR3L SDRAM, quad SPI flash, a Gigabit Ethernet PHY, dual Fast Ethernet PHYs and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.

The Mercury+ SA2 system-on-chip (SoC) module combines Intel’s Cyclone V ARM Processor-based SoC FPGA with fast DDR3L SDRAM, quad SPI flash, a Gigabit Ethernet PHY, dual Fast Ethernet PHYs and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.

The Mars XU3 system-on-chip (SoC) module combines AMD’s Zynqâ„¢ Ultrascale+â„¢ MPSoC device with fast DDR4 SDRAM, eMMC flash, quad SPI flash and a Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system.

The SO-DIMM form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application.

The Mars XU3 SoC module reduces development effort, redesign risk and improves time-to-market for your embedded system.

FPGA Device: ZU2CG, ZU2EG, ZU3EG.

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